Tesla Hires Intel Veteran Gary Jiang As Director for Terafab Chip Project
The 17-year Intel manufacturing veteran ran tool installation and ramp for Intel's cutting-edge 18A process before joining Tesla in Austin.
Tesla has hired Gary Jiang, a 17-year Intel manufacturing veteran, to lead its nascent Terafab semiconductor project as "Director, Terafab" — the first named leadership hire tied to the automaker's ambitious Austin chip fab effort.
What Happened
Jiang began his Tesla role this month in Austin, Texas, according to a verified LinkedIn profile spotted by Electrek. He spent 17 years and 9 months at Intel, most recently serving as Factory Manager from December 2024 responsible for "Intel 18A technology development transfer, construction/tool installation, and startup toward product certification, and high volume manufacturing capacity." His earlier roles covered Fab 32 and Fab 12 at Intel's Ocotillo campus in Chandler, Arizona, handling 14nm and 22nm high-volume production. Tesla began advertising Terafab positions earlier this month, seeking program managers with experience overseeing more than $100 million in capital expenditures.
Why It Matters
This hire signals where Tesla is sourcing the expertise it lacks: advanced semiconductor manufacturing operations. Tesla has no experience running a chip fab — designing processors for vehicles and Full Self-Driving is fundamentally different from fabricating them at scale. Intel brings process technology, equipment know-how, and packaging capability through its partnership announced in April. Adding an Intel 18A factory manager directly into the Terafab director role follows that same pattern of acquiring fab competence one veteran at a time. For buyers and owners, vertically integrated chip production could eventually insulate Tesla from future semiconductor supply disruptions that have plagued the auto industry.
The Bottom Line
Jiang's appointment is real progress and a genuine signal of intent for Terafab — but it remains early-stage work. Per SpaceX's S-1 filing, the project has no binding commitments, no finalized IP rights, and no firm financial terms despite initial investment estimates ranging from $55 billion to $119 billion across all phases. One experienced director does not close the gap between ambition and execution in semiconductor manufacturing.
